封装:
(45)
-(25)
Through Hole(293)
Board(1)
Solder(70)
100(3)
~(3)
Surface Mount(59)
`(1)
多选
包装:
(161)
-(1)
Tray(91)
Bulk(39)
Bag(75)
Box(1)
Tube(95)
Tape & Reel (TR)(2)
Tube, Rail(35)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列0.120 ”掌上垂直,带罩, withPress杉塑料栓, 7电路, 0.38μm ( 15μ “),金(Au )选择性电镀,锡( Sn)的PC 2.54mm (.100") Pitch SL™ Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 7 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC
    5203
    10-99
    9.2400
    100-499
    8.7780
    500-999
    8.4700
    1000-1999
    8.4546
    2000-4999
    8.3930
    5000-7499
    8.3160
    7500-9999
    8.2544
    ≥10000
    8.2236
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Shrouded Header HDR 3POS 2.54mm Solder ST Thru-Hole Tube
    3830
    10-99
    6.4200
    100-499
    6.0990
    500-999
    5.8850
    1000-1999
    5.8743
    2000-4999
    5.8315
    5000-7499
    5.7780
    7500-9999
    5.7352
    ≥10000
    5.7138
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Shrouded Header HDR 6POS 2.54mm Solder ST Thru-Hole Tube
    9084
    10-99
    9.6240
    100-499
    9.1428
    500-999
    8.8220
    1000-1999
    8.8060
    2000-4999
    8.7418
    5000-7499
    8.6616
    7500-9999
    8.5974
    ≥10000
    8.5654
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 8Circuits , 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
    5470
    10-99
    10.3560
    100-499
    9.8382
    500-999
    9.4930
    1000-1999
    9.4757
    2000-4999
    9.4067
    5000-7499
    9.3204
    7500-9999
    9.2514
    ≥10000
    9.2168
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 4Circuits ,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 4Circuits, Tin (Sn) Plating
    5582
    5-24
    5.2785
    25-49
    4.8875
    50-99
    4.6138
    100-499
    4.4965
    500-2499
    4.4183
    2500-4999
    4.3206
    5000-9999
    4.2815
    ≥10000
    4.2228
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 12Circuits , 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 12Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
    8822
    5-49
    32.6079
    50-199
    31.2144
    200-499
    30.4340
    500-999
    30.2390
    1000-2499
    30.0439
    2500-4999
    29.8209
    5000-7499
    29.6816
    ≥7500
    29.5422
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 6Circuits , 0.76μm ( 30μ “),金(Au )选择性电镀,锡(Sn ) PC端脚镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 6Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
    7687
    10-99
    9.8160
    100-499
    9.3252
    500-999
    8.9980
    1000-1999
    8.9816
    2000-4999
    8.9162
    5000-7499
    8.8344
    7500-9999
    8.7690
    ≥10000
    8.7362
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 12Circuits ,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 12Circuits, Tin (Sn) Plating
    5064
    5-49
    15.4791
    50-199
    14.8176
    200-499
    14.4472
    500-999
    14.3546
    1000-2499
    14.2619
    2500-4999
    14.1561
    5000-7499
    14.0900
    ≥7500
    14.0238
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距SL ™头,单列,立式, 0.120 ”口袋,带罩, 6Circuits ,锡(Sn )镀层 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 6Circuits, Tin (Sn) Plating
    1812
    5-24
    6.4260
    25-49
    5.9500
    50-99
    5.6168
    100-499
    5.4740
    500-2499
    5.3788
    2500-4999
    5.2598
    5000-9999
    5.2122
    ≥10000
    5.1408
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C-网格标题,分离式,双排,垂直,用固定销, 52电路, 8.13毫米 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 52 Circuits, 8.13mm
    8430
    5-49
    30.8412
    50-199
    29.5232
    200-499
    28.7851
    500-999
    28.6006
    1000-2499
    28.4161
    2500-4999
    28.2052
    5000-7499
    28.0734
    ≥7500
    27.9416
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 12电路, 6.10毫米( .240 ” )配合针脚长度, 0.76μm ( 30μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 6.10mm (.240") Mating Pin Length, 0.76μm (30μ") Gold (Au) Selective
    5905
    10-99
    10.6440
    100-499
    10.1118
    500-999
    9.7570
    1000-1999
    9.7393
    2000-4999
    9.6683
    5000-7499
    9.5796
    7500-9999
    9.5086
    ≥10000
    9.4732
  • 描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 8电路, 6.10毫米( .240 ” )配合针脚长度, 0.76μm ( 30μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240") Mating Pin Length, 0.76μm (30μ") Gold (Au) Selective
    9274
    5-24
    5.9535
    25-49
    5.5125
    50-99
    5.2038
    100-499
    5.0715
    500-2499
    4.9833
    2500-4999
    4.8731
    5000-9999
    4.8290
    ≥10000
    4.7628
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 72电路, 8.13毫米( 0.320 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 72 Circuits, 8.13mm (.320") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective
    1891
    1-9
    52.6552
    10-99
    49.6340
    100-249
    47.3897
    250-499
    47.0444
    500-999
    46.6991
    1000-2499
    46.3107
    2500-4999
    45.9654
    ≥5000
    45.7496
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C-网格标题,分离式,双排,垂直,用固定销, 66电路, 8.13毫米 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 66 Circuits, 8.13mm
    8483
    1-9
    49.9712
    10-99
    47.1040
    100-249
    44.9741
    250-499
    44.6464
    500-999
    44.3187
    1000-2499
    43.9501
    2500-4999
    43.6224
    ≥5000
    43.4176
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 4回路, 8.13毫米( 0.320 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 4 Circuits, 8.13mm (.320") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective
    2880
    5-24
    2.6190
    25-49
    2.4250
    50-99
    2.2892
    100-499
    2.2310
    500-2499
    2.1922
    2500-4999
    2.1437
    5000-9999
    2.1243
    ≥10000
    2.0952
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C-网格标题,分离式,双排,垂直,用固定销, 94电路, 6.10毫米 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 94 Circuits, 6.10mm
    7231
    1-9
    62.2725
    10-99
    59.5650
    100-249
    59.0777
    250-499
    58.6986
    500-999
    58.1030
    1000-2499
    57.8322
    2500-4999
    57.4532
    ≥5000
    57.1283
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 10电路, 8.13毫米( 0.320 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 10 Circuits, 8.13mm (.320") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective
    1498
    10-99
    6.7560
    100-499
    6.4182
    500-999
    6.1930
    1000-1999
    6.1817
    2000-4999
    6.1367
    5000-7499
    6.0804
    7500-9999
    6.0354
    ≥10000
    6.0128
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 78电路, 6.10毫米( .240 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 78 Circuits, 6.10mm (.240") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective
    7990
    5-49
    30.9933
    50-199
    29.6688
    200-499
    28.9271
    500-999
    28.7417
    1000-2499
    28.5562
    2500-4999
    28.3443
    5000-7499
    28.2119
    ≥7500
    28.0794
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 26电路, 6.10毫米( .240 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性电镀 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 26 Circuits, 6.10mm (.240") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective Plating
    1511
    5-49
    23.5053
    50-199
    22.5008
    200-499
    21.9383
    500-999
    21.7977
    1000-2499
    21.6570
    2500-4999
    21.4963
    5000-7499
    21.3959
    ≥7500
    21.2954
  • 描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 28电路, 6.10毫米( .240 ” )配合针脚长度, 0.38μm ( 15μ “),金(Au )选择性 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 28 Circuits, 6.10mm (.240") Mating Pin Length, 0.38μm (15μ") Gold (Au) Selective
    4893
    5-49
    24.8625
    50-199
    23.8000
    200-499
    23.2050
    500-999
    23.0563
    1000-2499
    22.9075
    2500-4999
    22.7375
    5000-7499
    22.6313
    ≥7500
    22.5250
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 12电路, 8.13毫米( 0.320 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating
    6697
    5-24
    4.4415
    25-49
    4.1125
    50-99
    3.8822
    100-499
    3.7835
    500-2499
    3.7177
    2500-4999
    3.6355
    5000-9999
    3.6026
    ≥10000
    3.5532
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Unshrouded Header HDR 16POS 2.54mm Solder ST Thru-Hole Bulk
    8010
    5-49
    13.1976
    50-199
    12.6336
    200-499
    12.3178
    500-999
    12.2388
    1000-2499
    12.1598
    2500-4999
    12.0696
    5000-7499
    12.0132
    ≥7500
    11.9568
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 6电路, 8.13毫米( 0.320 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 6 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating
    4319
    5-24
    1.8765
    25-49
    1.7375
    50-99
    1.6402
    100-499
    1.5985
    500-2499
    1.5707
    2500-4999
    1.5360
    5000-9999
    1.5221
    ≥10000
    1.5012
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 70电路, 8.13毫米( 0.320 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 70 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating
    9190
    1-9
    42.7488
    10-99
    40.2960
    100-249
    38.4739
    250-499
    38.1936
    500-999
    37.9133
    1000-2499
    37.5979
    2500-4999
    37.3176
    ≥5000
    37.1424
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 72电路, 8.13毫米( 0.320 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 72 Circuits, 8.13mm (.320") Mating Pin Length, Tin (Sn) Plating
    5678
    1-9
    43.8834
    10-99
    41.3655
    100-249
    39.4951
    250-499
    39.2073
    500-999
    38.9195
    1000-2499
    38.5958
    2500-4999
    38.3081
    ≥5000
    38.1282
  • 描述:
    2.54mm 方针
    6084
    5-49
    19.0359
    50-199
    18.2224
    200-499
    17.7668
    500-999
    17.6530
    1000-2499
    17.5391
    2500-4999
    17.4089
    5000-7499
    17.3276
    ≥7500
    17.2462
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.54毫米( .100“ )间距C- Grid®头,分离式,双排,垂直,与RetentionPin , 70电路, 6.10毫米( .240 ” )配合针脚长度,锡(Sn )镀层 2.54mm (.100") Pitch C-Grid® Header, Breakaway, Dual Row, Vertical, with RetentionPin, 70 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
    8617
    1-9
    39.6500
    10-99
    37.3750
    100-249
    35.6850
    250-499
    35.4250
    500-999
    35.1650
    1000-2499
    34.8725
    2500-4999
    34.6125
    ≥5000
    34.4500
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Unshrouded Header HDR 78POS 2.54mm Solder ST Thru-Hole Bulk
    6993
    1-9
    51.4596
    10-99
    48.5070
    100-249
    46.3136
    250-499
    45.9762
    500-999
    45.6388
    1000-2499
    45.2591
    2500-4999
    44.9217
    ≥5000
    44.7108
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    Conn Unshrouded Header HDR 48POS 2.54mm Solder ST Thru-Hole Bulk
    4587
    5-49
    30.8997
    50-199
    29.5792
    200-499
    28.8397
    500-999
    28.6549
    1000-2499
    28.4700
    2500-4999
    28.2587
    5000-7499
    28.1267
    ≥7500
    27.9946
  • 品牌: Molex (莫仕)
    封装:
    Through Hole
    描述:
    2.50毫米( .098 “ )间距线对板头, 1.02毫米( 0.040 ” )选项卡,垂直, 20 CircuitsGray 2.50mm (.098") Pitch Wire-to-Board Header, 1.02mm (.040") Tab, Vertical, 20 CircuitsGray
    8167
    5-49
    14.5080
    50-199
    13.8880
    200-499
    13.5408
    500-999
    13.4540
    1000-2499
    13.3672
    2500-4999
    13.2680
    5000-7499
    13.2060
    ≥7500
    13.1440

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